JPS6317263Y2 - - Google Patents

Info

Publication number
JPS6317263Y2
JPS6317263Y2 JP1982021307U JP2130782U JPS6317263Y2 JP S6317263 Y2 JPS6317263 Y2 JP S6317263Y2 JP 1982021307 U JP1982021307 U JP 1982021307U JP 2130782 U JP2130782 U JP 2130782U JP S6317263 Y2 JPS6317263 Y2 JP S6317263Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
insulating plate
ceramic
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982021307U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58124985U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2130782U priority Critical patent/JPS58124985U/ja
Publication of JPS58124985U publication Critical patent/JPS58124985U/ja
Application granted granted Critical
Publication of JPS6317263Y2 publication Critical patent/JPS6317263Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2130782U 1982-02-16 1982-02-16 プリント基板 Granted JPS58124985U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2130782U JPS58124985U (ja) 1982-02-16 1982-02-16 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2130782U JPS58124985U (ja) 1982-02-16 1982-02-16 プリント基板

Publications (2)

Publication Number Publication Date
JPS58124985U JPS58124985U (ja) 1983-08-25
JPS6317263Y2 true JPS6317263Y2 (en]) 1988-05-16

Family

ID=30033434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2130782U Granted JPS58124985U (ja) 1982-02-16 1982-02-16 プリント基板

Country Status (1)

Country Link
JP (1) JPS58124985U (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147575A (en]) * 1974-05-17 1975-11-26
JPS5917880B2 (ja) * 1976-09-07 1984-04-24 株式会社東芝 電気装置用基板
JPS56155585A (en) * 1980-04-30 1981-12-01 Shin Kobe Electric Machinery Printed circuit board

Also Published As

Publication number Publication date
JPS58124985U (ja) 1983-08-25

Similar Documents

Publication Publication Date Title
US6262477B1 (en) Ball grid array electronic package
US6159586A (en) Multilayer wiring substrate and method for producing the same
US4480013A (en) Substrate for use in semiconductor apparatus
JP2002016181A (ja) 半導体装置、その製造方法、及び電着フレーム
JP2005277356A (ja) 回路装置
JPS62230027A (ja) 半導体装置の製造方法
US20060214295A1 (en) Circuit board and manufacturing method thereof
JP2002118213A (ja) 半導体装置および半導体モジュール
JPS59198790A (ja) プリント配線基板
JPH01276750A (ja) 半導体装置
JPS6317263Y2 (en])
JPH03195053A (ja) インバータ装置
JPH05211256A (ja) 半導体装置
JPH03195083A (ja) 混成集積回路およびその製造方法
JPH0613723A (ja) 混成集積回路
JPS61287194A (ja) 電子素子用チツプキヤリア
JPS61121489A (ja) 基板製造用Ｃｕ配線シ−ト
JPS6134989A (ja) 電子部品搭載用基板
JPH1074859A (ja) Ｑｆｎ半導体パッケージ
JPS59184586A (ja) 半導体素子搭載用回路基板
JPS60160691A (ja) 厚膜パタ−ン形成方法
JPH08264910A (ja) 放熱板付きプリント配線板の作製方法及びプリント配線板へのハイパワー部品の実装方法
JPS60178655A (ja) リ−ドフレ−ム
JPS5967687A (ja) プリント配線基板
JPS59217385A (ja) プリント配線基板